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Silver Nanoparticles - メーカー・企業4社の製品一覧とランキング

Silver Nanoparticlesの製品一覧

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True NANO Silver® Nanoparticles

True NANO Silver® Nanoparticles

Exhibiting excellent nano properties! Silver nanoparticles produced by organometallic methods and the Recanalization method.

"True NANO Silver(R)" is a silver nanoparticle that can bond aluminum with high conductivity, high thermal conductivity, and high heat resistance. It eliminates the need for equipment such as atmosphere adjustment furnaces and welding machines, achieving a reduction in material costs. This is expected to contribute to the lightweighting of electrical and electronic devices, including motors. Additionally, it is capable of bonding a wide variety of materials, not just aluminum. [Features] ■ Excellent physical properties ■ High productivity ■ Low introduction costs *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials

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Silver nanoparticles 'LS0305'

Silver nanoparticles 'LS0305'

TG (N2) is 0.1 to 0.35%! Introducing low-temperature sintered silver that can accommodate multiple solvent dispersions!

We would like to introduce our silver nanoparticles 'LS0305'. The particle shape is polyhedral, the particle size ranges from 0.15 to 0.4 μm, and the specific surface area is between 1.2 and 2.2 m²/g. We can accommodate multiple solvent dispersions. The shipping form is solvent dispersion, and the dispersible solvents include water, EtOH, DPM, C, CA, BC, TPM, and BCA. 【Characteristics (partial)】 ■ Particle shape: Polyhedral ■ Particle size (μm): 0.15 to 0.4 ■ Specific surface area (m²/g): 1.2 to 2.2 ■ Tap density (g/cm³): 4.5 to 6.5 ■ TG<N2> (%): 0.1 to 0.35 * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

  • Other metal materials

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Silver nanoparticles 'N300'

Silver nanoparticles 'N300'

The electrical resistivity is 4.4 μΩ·cm (after sintering)! TG (N2) is 0.70 to 1.30%!

We would like to introduce our silver nanoparticles 'N300'. The tap density is 1.5–3.0 g/cm³, the specific surface area is 1.9–2.9 m²/g, and the thickness is ≤50 nm. The shipping form is powder. Additionally, the particle shape is flake-shaped, and the particle size is 0.3–0.5 μm. 【Properties (partial)】 ■ Particle shape: Flake shape ■ Particle size (μm): 0.3–0.5 ■ Thickness (nm): ≤50 ■ Specific surface area (m²/g): 1.9–2.9 ■ Tap density (g/cm³): 1.5–3.0 * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

  • Other metal materials

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Silver nanoparticles for low temperature and low pressure/no pressure sintering.

Silver nanoparticles for low temperature and low pressure/no pressure sintering.

Achieve a dense silver sintered layer at low temperature and low pressure / without applied pressure! A lineup of silver nanoparticles ranging from nano to submicron diameter.

We would like to introduce the new development product "Silver Nanoparticles" from Osaka Soda Co., Ltd. By applying silver nanoparticle synthesis technology, we have created a lineup of silver nanoparticles with particle sizes not available in conventional commercial products, while maintaining high low-temperature sinterability. As an application example, by combining with commercially available silver particles to achieve a densely packed design, we can achieve high reliability, bonding strength, and conductivity with a dense and low-shrinkage sintered bonding layer even under low-temperature and no-pressure bonding conditions. 【Features of the added silver sintered layer】 ■ High thermal conductivity ■ Low electrical resistance ■ High bonding strength ■ Improved thermal reliability *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors

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[Data] Catalog of Low Melting Point Silver Particles

[Data] Catalog of Low Melting Point Silver Particles

A catalog featuring the size and characteristics of "silver submicron particles for low-temperature sintering" and "silver plate-like particles for low-temperature sintering."

This document introduces "low melting point silver particles." It includes the size, characteristics, applications, and photos of "submicron silver particles for low-temperature sintering" and "plate-shaped silver particles for low-temperature sintering." Additionally, as supplementary data, we have included SEM images of the sintering state at 300°C, so please take a look. [Contents] ■ Submicron silver particles for low-temperature sintering ■ Plate-shaped silver particles for low-temperature sintering ■ Supplementary data *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Silver nanoparticles

Silver nanoparticles

Silver powder that achieves world-class conductivity and low-temperature sintering characteristics.

Attention semiconductor and circuit board designers! Are you looking to enhance the conductivity of your products and reduce the sintering temperature? There are silver nanoparticles that exhibit remarkable performance in semiconductors and circuit boards, which are increasingly demanding higher performance. Introducing "TOSFINE" from Tokusen Industries. "TOSFINE" is produced using our unique particle manufacturing technology, which processes each particle into a flake shape, resulting in silver powder that combines the handling properties of flakes with the characteristics of nanoparticles. "TOSFINE" boasts high conductivity and high mirror-like finish under dry conditions due to its highly smooth surface. 【Features】 - Achieves high conductivity and heat dissipation with single crystal flakes. - Exhibits sintering properties at low temperatures (120-200°C). - Realizes high conductivity even under dry conditions due to its high surface smoothness. - Offers a uniform particle size distribution thanks to our unique manufacturing method. - We can propose particle sizes and surface treatments tailored to your applications.

  • Other metal materials

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Silver nanoparticles "KM120"

Silver nanoparticles "KM120"

Particle size is 0.15 to 0.3 μm! Introducing silver powder that achieves world-class low-temperature sinterability!

We would like to introduce our silver nanoparticles 'KM120'. The particle shape is polyhedral, with a specific surface area of 1.5 to 2.5 m²/g and a tap density of 3.0 to 4.5 g/cm³. It achieves world-class low-temperature sinterability. Additionally, the surface treatment includes coatings with hexanoic acid, lauric acid, palmitic acid, stearic acid, and oleic acid. 【Characteristics (partial)】 ■ Particle shape: Polyhedral ■ Particle size (μm): 0.15 to 0.3 ■ Specific surface area (m²/g): 1.5 to 2.5 ■ Tap density (g/cm³): 3.0 to 4.5 ■ TG <N2> (%): 0.1 to 0.3 *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other metal materials

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Silver nanoparticles 'LM1'

Silver nanoparticles 'LM1'

The particle shape is flake shape + polyhedron, and the specific surface area is 0.5 to 1.5 m²/g! Silver powder specialized for adhesion!

We would like to introduce our silver nanoparticles 'LM1'. The surface treatment is coated with hexanoic acid, lauric acid, palmitic acid, stearic acid, and oleic acid. The particle size ranges from 0.7 to 1.3 μm, with a thickness of ≦100 nm and a tap density of 2.0 to 4.0 g/cm³. 【Characteristics (partial)】 ■ Particle shape: Flake shape + polyhedral ■ Particle size (μm): 0.7 to 1.3 ■ Thickness (nm): ≦100 ■ Specific surface area (m²/g): 0.5 to 1.5 ■ Tap density (g/cm³): 2.0 to 4.0 * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

  • Other metal materials

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Silver nanoparticles "M13"

Silver nanoparticles "M13"

The particle shape is flake-shaped! The tap density is 1.5 to 3.0 g/cm3, and the specific surface area is 0.6 to 1.6 m2/g!

We would like to introduce our silver nanoparticles 'M13' that we handle. The shipping form is powder. The dispersible solvents include water, EtOH, DPM, C, EG, CA, TP, BC, TPM, and BCA. As for the characteristics, the particle size ranges from 1.0 to 3.0 μm, and the thickness is between 40 to 60 nm. 【Characteristics (partial)】 ■ Particle shape: Flake shape ■ Particle size (μm): 1.0 to 3.0 ■ Thickness (nm): 40 to 60 ■ Specific surface area (m²/g): 0.6 to 1.6 ■ Tap density (g/cm³): 1.5 to 3.0 * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Other metal materials

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Silver nanoparticles 'M27'

Silver nanoparticles 'M27'

Surface coating with hexanoic acid, lauric acid, palmitic acid, stearic acid, and oleic acid!

We would like to introduce our silver nanoparticles 'M27'. The particle shape is flake, with a particle size of 2.0 to 7.0 μm and a thickness of 60 to 100 nm. The specific surface area is 0.5 to 1.5 m²/g, and the tapped density is 1.5 to 3.0 g/cm³. Additionally, the electrical resistivity is 3.8 μΩ·cm (after sintering). 【Characteristics (partial)】 ■ Particle shape: Flake ■ Particle size (μm): 2.0 to 7.0 ■ Thickness (nm): 60 to 100 ■ Specific surface area (m²/g): 0.5 to 1.5 ■ Tapped density (g/cm³): 1.5 to 3.0 *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other metal materials

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Silver nanoparticles "M612"

Silver nanoparticles "M612"

The dispersible solvents include water, EtOH, DPM, C, EG, CA, TP, BC, TPM, and BCA!

We would like to introduce our silver nanoparticles 'M612' that we handle. The particle shape is flake, and the particle size ranges from 6.0 to 12.0 μm, with a thickness of 60 to 100 nm. The surface treatment consists of surface coating with hexanoic acid, lauric acid, palmitic acid, stearic acid, and oleic acid. 【Characteristics (partial)】 ■ Particle shape: Flake ■ Particle size (μm): 6.0 to 12.0 ■ Thickness (nm): 60 to 100 ■ Specific surface area (m²/g): 0.5 to 1.5 ■ Tapped density (g/cm³): 1.5 to 3.0 * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Other metal materials

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Adopted in various fields such as electromagnetic materials and semiconductors! Silver nanoparticles.

Adopted in various fields such as electromagnetic materials and semiconductors! Silver nanoparticles.

This is a silver powder that achieves high conductivity and low-temperature sintering characteristics. We are currently offering a document that includes a lineup overview!

Attention semiconductor and circuit board designers! Are you looking to increase the conductivity of your products and reduce sintering temperatures? There are silver nanoparticles that demonstrate remarkable performance in semiconductors and circuit boards, which are increasingly demanding high performance. Introducing "TOSFINE" from Toxen Industries. "TOSFINE" is created through our unique particle manufacturing technology, which processes each particle into a flaky shape, resulting in silver powder that combines the handling properties of flakes with the characteristics of nanoparticles. "TOSFINE" boasts high conductivity and high mirror-like finish under dry conditions due to its high surface smoothness. 【Features】 - Achieves high conductivity and heat dissipation through single crystal flakes. - Exhibits sintering properties under low-temperature conditions (120-200°C). - Realizes high conductivity even under dry conditions due to its high surface smoothness. - Has a uniform particle size distribution thanks to our unique manufacturing method. - We can propose particle sizes and surface treatments tailored to your specific applications.

  • Other metal materials

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